Thermal PAD 21-869-150-0660
Series: 21-869
Thermal PAD 21-869-150-0660 100*200*1.5
JONES Thermal Pad 21-869 is an ultra soft putty like gap filling material rated at a thermal conductivity of 7.0 W/m-K.It is highly conformable to uneven and rough surfaces, where require the thermal gap filler material has a characteristics of over 50% compressibility.Its soft construction offers high conformability and effectively reduces thermal resistance.
JONES Thermal Pad 21-869 is natually tacky and 21-869A is single-side tacky, both of which facilitate easy handling and simplified application.
Characteristics And Advantages
- Thermal Conductivity :7.0W/m·K
- Ultra Soft (Putty Like)
- Extremely Good Thermal Performance
Application Area
Telecommunication Hardware
Power Electronic Equipment
