With the development trend of digitization, intelligence and miniaturization, some wearable medical monitoring products have come out. Such wearable products can monitor different physiological indicators of human body in real time and provide good data reference for preventing sudden illness or body health. However, these wearable products often have special requirements for heat conduction, shielding and packaging. Meanwhile, the requirement for image definition of diagnostic equipment such as MR, CT and X-ray machines is increasingly higher, which prompts medical equipment manufacturers to choose high-speed chips and high-power devices. In this case, it further leads to EMC and thermal design of these diagnostic devices requiring continuous improvement in performance to meet the increasing interference and excess heat energy. JONES has completed a large number of EMC rectification experiences and thermal design projects in cooperation with internationally renowned medical equipment companies. This has enabled our company to accumulate rich experience in thermal management, shielding, earthing and wave filter of medical equipment, so that our company can systematically solve customer’s problems related to EMC and heat dissipation.
Conductive rubber material
The conductive rubber material is a type of polymer material which is independently developed by our company by filling conductive particles in silicone rubber. It has good EMI shielding effect and excellent water/steam sealing and corrosion resistance. Thanks to the independently developed formulation, Jones’ conductive rubber products to have a wider operating temperature range and a longer service life. According to the customer’s specific application scenarios, JONES’s conductive rubber series can provide: compression molded gasket, extruded rubber strip, co-extruded conductive rubber strip, coated conductive rubber strip and so on.
Jones can customize a variety of injection molded, compression molded and extruded rubber products to meet customers’ specific applications. With different fillers, material can be divided into conductive rubber and non-conductive rubber. It can be designed into complex shapes to provide effective EMI shielding and environmental sealing.
Thermal Pad is a thermal conductive composite material with a certain thermal conductivity and flexibility. It is mainly used for gap filling between semiconductor devices and heat sinks, and improves the transfer efficiency of the heat generated by semiconductorsvduring operation.
Form in place
FIP conductive rubber gasket (form-in-place) can automatically dispense high-conductivity rubber on metal or plastic substrate to form EMI shielding gasket according to customer’s different design with computer-aided programming dispensing equipment.The gasket is made by filling different conductive particles in a silicone rubber. It has good elasticity and cured at a high temperature to form an electromagnetic and environmental sealing material. Our company can provide FIP materials with different packaging and different hardness according to different shielding performance requirements of customers, and can provide a total solution for conductive FIP products.
Fabric over foam
FOF consists of conductive fabric layer and foam core, which can be processed into various shapes. The compressibility and resilience of foam core can meet the requirements of low sealing force. It is widely used in EMI protection of electronic equipment’s housing and provides EMI shielding at the cabinet gap.
Three-way conductive foam—-Ni-plated PU foam provides good electrical conductivity while maintaining low compressive stress and high deformation characteristics. It is not limited to the outer conductive structure as that of traditional FOF gasket,can be designed according to the application required dimension without affecting the conductivity.
The heat pipe is a kind of heat-conducting material. It makes full use of the heat-conducting principle and the fast heat-transfer properties of the phase-change medium to quickly transfer the heat of the heating object to the outside. Its thermal conductivity of heat pipe exceeds that of any known metal.
Vapor Chamber is a vacuum cavity with a fine structure on the inner wall. The purpose of heat dissipation is achieved through the vaporization and condensation of the cooling liquid in the cavity, which is usually used for electronic products that require a small volume or need to quickly dissipate high heat.