Thermal PAD 21-233-SP01-300-0132
Series: 21-233-SP01
Thermal PAD 21-233-SP01-300-0132 100*100*3
JONES Thermal Pad 21-233-SP01 is designed to provide good thermal performance and adhesion or natural tack.It demonstrates highly
conformable to uneven and rough surfaces with minimal thermal gap filler compression.
JONES Thermal Pad 21-233-SP01 is available in custom die-cut parts, sheets and rolls, which makes it easy handling and simplified application. It’s also available in a variety of thicknesses and hardness.
Characteristics And Advantages
- Thermal Conductivity :3.0W/m·K
- Single-Side Sticky
- Very Good Thermal Performance
- Good Compressibility and Elasticity
Application Area
Telecommunication Hardware
Power Electronic Equipment
