Thermal pad

Thermal PAD 21-233-300-0816

Series: 21-233

Thermal PAD 21-233-300-0816 406*203*3

JONES Thermal Pad 21-233 is designed to provide good thermal performance and adhesion or natural tack.It demonstrates highly
conformable to uneven and rough surfaces with minimal thermal gap filler compression.

JONES Thermal Pad 21-233 is available in custom die-cut parts, sheets and rolls, which makes it easy handling and simplified application. It’s also available in a variety of thicknesses and hardness.

Characteristics And Advantages

  • Thermal Conductivity :3.0W/m·K
  • Very Good Thermal Performance
  • Good Compressibility and Elasticity
  • Tiny Outgassing

Application Area

Telecommunication Hardware

Power Electronic Equipment

Mass Storage Devices