Thermal PAD 21-881-250-0660
Series: 21-881
Thermal PAD 21-881-250-0660 100*200*2.5
JONES Thermal Pad 21-881 is an ultra soft putty like gap filling material rated at a thermal conductivity of 8.0 W/m-K. It is conformable to uneven and rough surfaces, where require excellent compressibility to the thermal gap filler.Its soft construction offers high conformability and imparts minimum pressure to electronic components.
Characteristics And Advantages
- Thermal Conductivity :8.0W/m·K
- Ultra Soft (Putty Like)
- Extremely Good Thermal Performance
Application Area
Telecommunication Hardware
Power Electronic Equipment
